SEMICON Taiwan 2013 International Semiconductor Exhibition will start next month, starting this year, 3DIC (3-Dimensional Integrated Circuit, three-dimensional stacked chips), green manufacturing, precision machinery and system level packaging as the theme, and another LED (Light Emitting Diode, Light Emitting Diode body) Process Exhibition, will be held in 15 games and also international forum and invited several well-known business owners to participate, is expected to become the focus of attention.International Semiconductor Equipment and Materials Industry Association (Semiconductor Equipmentand Materials International, SEMI) said that this year a total of 17 countries from around the world, is expected to more than 650 exhibiting companies. This year's International Forum invited TSMC (2330), Georgia Luofang De, IBM, Micron, Qualcomm, STMicroelectronics, Samsung and other more than 110 international industry giants come to speech. SEMICON Taiwan 2013 is expected to attract more than 30,000 people view exhibitions and participate in forums.SEMI Taiwan cum Southeast Terry Tsao, president, said since the second half of 2013, the semiconductor equipment industry, the rapid economic recovery, investment in the face of an optimistic outlook, coupled with the recent being rammed the 3D printing industry driven micro-systems and precision machinery market opportunities, SEMICONTaiwan semiconductor industry will master the latest technology trends, as well as explore business opportunities in the important event. This year, in addition to Semiconductor Leaders Forum, the year held a "system-level testing and packaging International Forum", presenting the latest developments 3DIC chip integration technology achievements.Where "system-level testing and packaging International Forum" forum was divided 3DIC technology trends embedded component technology forum with two parts, respectively, from 3DIC technology development challenges and opportunities, as well as a buried substrate technology and other aspects, invited ASE (2311) , UMC (2303), STMicroelectronics, Amkor (Amkor), Intel (Intel), STATSChipPAC other global technology experts to share 3DIC, TSV interpolation technique with the use of silicon (SiliconInterposer) experience, as well as a substrate for a buried 2.5 D/3DIC related perspective, a comprehensive analysis 3DIC technology's future development.TSMC chairman Morris Chang has pointed out, 3DIC chip manufacturing is the future trend of development is limited because of Moore's Law in a chip development, but can be extended to 3DIC packaging field, you can create more development space, and TSMC announced that from wafer fabrication extends to packaging and testing areas, whole pieces of wafer products provide packaging and testing industry action allows considerable concern.However, although confidence in TSMC 3DIC areas open innovative business models and provide customer segments before and after the whole pieces 3DIC service. But Chang also believes that, 3DIC mass production is expected in 2013, the short-term on a limited contribution to the performance, you may want to wait until 2015 to 2016 when the whole industry supply chain will mature after more visible inject revenue.
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